No worries, I'm still working on this - main limiting factor is money (although, pre-orders and donations from generous ones help *very* much) and time.

I was even able to ruin my main N900's motherboard, while doings tests (fatal mistake from my side, nothing to do with equipment).

Main change now, is moving from "mill moving in 3D above desk" to "desk moving in 3D below mill". the first variant works well for bigger parts, but is too low on being precise for small N900 case factor.

Another thing, is that changing V due to heat generated while milling is much more of a concern, than I've initially though (milled part is becoming "bigger" during milling, then smaller afterwards = precision is lost). I'm overcoming it by special variant of water+oil cooling of *material* being milled (water cooling of mill itself is totally different, more easy thing) - Basically, water mixed with special oil (that emulgates with water) is constantly cooling material in place, where mill works, then, it drops below, is collected, pumped up again, etc. Of course, cooler circuit is only semi-closed - as area of milling must be open - so I'm still losing some coolant in the process, but a magnitude less than colling without re-cycling. Otherwise, coolant used during milling would be more expensive than aluminum itself

/Estel