Well, they're already at 82% of their goal and it launched yesterday (I think?), so I'd say they're doing pretty good! They also understand they need a community and are developing a SDK... I dunno, it all sounds pretty good to me

Only thing is, I'm hesitant about the quality of the materials, the wear and tear of the connecting/slide-in mechanism, whether or not it really works... (a.k.a. how error-prone is it), and the thickness of the case, meaning, how does it hold? Other than that, cool development I'd say!