My guess is that the solder lands (=solder mask openings) on the board were checked and maximised in size to allow larger solder contact for better strength. At the same time stencil (=template that is used to apply solder paste to board) openings were widened to allow more solder paste. At extreme cases a "step stencil" could be used to allow even more solder paste in certain locations.

The only other alternative would have been to change the mounting method to through hole connector. All evidence point that this is not the case.

Needless to say that I'm also extremely careful when plugging and removing the charger cable...