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Posts: 1,729 | Thanked: 388 times | Joined on Jan 2010 @ Canada
#668
Originally Posted by Texrat View Post
There is no soldering iron. There is no way to get one into that spot even. Rather, high-volume processes like wave or flow soldering are used.

These processes tend to be so robust that soldering defects very rarely occur. As for the pad removal-- I'm betting a PCB surface preparation problem. Copper lands should not come off, either... even under stress.
the PCB? hmmmm....not fully understand but a bit clear to me.

I usually take my old devices to some professionals when its out of warranty period. almost all of them said that my devices caused to be faulty because the PCB is damaged (someone said burnt). and all cases are in terms of hardware. usually, the issues of my old phones are not charging, not rebooting properly, NOKIA Screen of Death (in one case).