Thread: Problems with N900 USB port becoming broken / loose and resulting warranty & repair issues
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Mara is offline Mara
2010-02-26 , 17:48
Posts: 1,310 | Thanked: 820 times | Joined on Mar 2006 @ Irving, TX
#854
Originally Posted by Texrat View Post
I have to wonder about that. Typically in surface mount assembly, at least a small amount of adhesive is placed under the component body to secure it prior to wave or flow soldering. Did you note this to not be the case here?
I don't think there is: The adhesive is only used for components that will be going through wave soldering. AFAIK Nokia (like most if not all manufacturers making pure SMT assemblies) only uses solder paste and reflow (IR), thus no adhesive needed.
 

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