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Posts: 1,729 | Thanked: 388 times | Joined on Jan 2010 @ Canada
#863
Originally Posted by cr0c0 View Post
Although my phone is 03/2010, I think they're all the same.

See, a much more reasonable explanation of the situation (rather than assuming Nokia made some changes that cannot be determined with the naked eye) is that Nokia did not change anything at all except their press releases. Not unlike Toyota removing floor mats I suppose.

I want to see pictures of new units that either use through mounted USB ports (highly unlikely since it requires a motherboard redesign) OR much larger solder pads OR a new plastic casing design that provides support for the USB port. That's when I'll believe Nokia did something about it.

Improving the technique for surface mounting the USB port won't help one bit if somehow the USB cable gets snagged and pulls sideways or downwards, or if the user tries to insert it upside down or is simply a butter fingers that cannot correctly align it with the port.
so the problem is poor adhesiveness of the port to the board.

what do you think are the changes (hopefully) will nokia make?
if they will only add an amount of soldering iron, why did they not do that in the first place? or doing that may result into something?

and if changes occur, will they assure that this issue will not be present?

Sorry for a lot of questions,