Something interesting worth consideration: As chip fabrication technology improves and production ramps up, I wonder how many facilities will be included on the IC. For example, it may be possible in future to have an SoC specifically for a particular handset, containing all of the facilities for touch-sensing, driving the display, environment sensing, etc! This would not only shrink the package incredibly, it would lower power consumption, lower costs, simplify development, and lower time to market. The chip specification would be a diagram, with portions of the IC purchased from various companies (as it is now). But I believe it would have another larger benefit: it would open the door for smaller companies to get in on the action, both on the design and product side. In short, the big players may find themselves in a sea of smaller ones, which could mean far more diversity for the consumer, and interesting new technologies! Very exciting times ahead.