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2013-11-21
, 20:54
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Posts: 439 |
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Joined on Oct 2012
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#1322
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See also here. Some of these vendors may need to contacted to find out what's available. It seems Hynix also do an 8Gb LPDDR 168 ball PoP.
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2013-11-21
, 21:08
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Posts: 2,222 |
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Joined on Mar 2010
@ SOL 3
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#1323
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how about this? http://www.directindustry.com/prod/h...7-1274567.html
by the way is listed 1-*(to) 4 GB
buy hynix trought intermediars ?
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2013-11-21
, 21:13
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Posts: 439 |
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Joined on Oct 2012
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#1324
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2013-11-21
, 21:49
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Posts: 2,222 |
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Joined on Mar 2010
@ SOL 3
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#1325
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2013-11-22
, 05:42
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Posts: 694 |
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Joined on Nov 2011
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#1326
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2013-11-23
, 04:05
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Posts: 18 |
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Joined on Apr 2011
@ whitsundays
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#1327
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2013-11-23
, 06:35
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Posts: 2,222 |
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Joined on Mar 2010
@ SOL 3
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#1328
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2013-11-23
, 08:00
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Posts: 132 |
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Joined on Jan 2013
@ Nairobi Kenya
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#1329
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2013-11-23
, 11:41
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Posts: 915 |
Thanked: 3,209 times |
Joined on Jan 2011
@ Germany
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#1330
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Hi
just a question about 3g compatibility since about 12 months ago Telstra in Australia changed there 3g network which left the Nokia n900 with no 3g access.
Will the Neo n900 have the same issue?
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neo900, thank you! |
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actually when I clicked on your link, Konqueror told me its "<2>" (= second window on same URL). Alas hynix is not really easy to approach for what they offer, you seem to have to call them or mail them. The MCP NAND+RAM package quoted on your 2nd link is a 1GByte NAND plus 512MB RAM. We need 1GByte RAM and we don't care too much about NAND, though of course a 512+MB of NAND on same package would be more than welcome. Anyway we can do NAND on discrete chip, while RAM interface is only available on PoP balls of DM3730 in the CBP package we need to use. We are pondering to go for CUS package (no PoP at all) but that would cost us a UART and a McBSP :-/
PS: the micron 8Gbit density PoP RAM
datasheet
again only states 2Gbit density,
BTW there's a tiny detail that makes our life as hw-engineers a whole lot harder than sw-engineers usually understand it was: when we decide for a component, then we need to know ONEHUNDRED PERCENT that it will fit and match and work. Then we have to spend a lot of money and time to *get* the component and integrate it into the design. And if we fail and picked the wrong component, we easily can burn 100s of k$. IOW we must act impeccable. Any OOOPS is a killer. While software engineers just deploy a patch to fix their oopsies ;-)
/j
Last edited by joerg_rw; 2013-11-21 at 19:18.