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2009-09-17
, 09:24
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Posts: 3,404 |
Thanked: 4,474 times |
Joined on Oct 2005
@ Germany
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#2
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2009-09-17
, 09:31
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Posts: 1,400 |
Thanked: 3,751 times |
Joined on Sep 2009
@ Arctic cold of northern .fi
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#3
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2009-09-17
, 10:10
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Posts: 3,319 |
Thanked: 5,610 times |
Joined on Aug 2008
@ Finland
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#4
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2009-09-17
, 10:21
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Posts: 282 |
Thanked: 120 times |
Joined on Nov 2007
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#5
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2009-09-17
, 10:29
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Posts: 3,404 |
Thanked: 4,474 times |
Joined on Oct 2005
@ Germany
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#6
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I just might be just pushing the little thing too hard but I did manage to get my N810 backplate discolored from the heat, so...
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2009-09-17
, 10:43
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Posts: 4,384 |
Thanked: 5,524 times |
Joined on Jul 2007
@ ˙ǝɹǝɥʍou
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#7
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2009-09-17
, 11:17
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Posts: 3,404 |
Thanked: 4,474 times |
Joined on Oct 2005
@ Germany
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#8
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2009-09-17
, 12:00
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Posts: 109 |
Thanked: 26 times |
Joined on Aug 2007
@ Caribbean
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#9
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As some of you might have read, the iphone 3gs is said to have a serious heat problem. Since it has a very similar chipset as the n900, this got me thinking.
- On the one hand, apple hardware is more prone to overheating because their designers don't care about "form follows function", but instead value clean, closed surfaces and avoid venting holes etc.
- on the other hand, my samsung z500 umts cellphone can become quite warm when using 3g continuously.
- none of the internet tablets has had a cellphone modem, and the n900 has even less surface area to dispel heat, yet it has multiple transmitters integrated.
- BUT: nokia engineers usually know their stuff.
Could someone with a n900 prototype share some info on this, please?